28/07/26 Tue 8:40am
Topics:
- Surface Mount Technology
- SMT components
- process & reflow
- PCB manufacture
- PCB design rules
what can interfere with a circuit or electronic product’s life cycle, heat , emi
Electronic Packaging Hierarchy
- L0 Chip/Die
- L1 Component Package
- L2 Printed Circuit Board
- L3 System / Enclosure
SMT vs Through Hole Technology
| SMT | THT |
|---|---|
| Components mount ON the Board surface | Leads inserted through drilled holes |
| No drilled holes | soldered on the opposite side |
| very small footprint down to 0.4 x 0.2 mm | larger footprint, stronger mechanical bond |
| fully automated pick-and-place + reflow | Manual or wave soldering |
| high component density shorter leads better RF/HF performance | preferred for connectors and high power / higher stress parts |
| used in phones laptops and wearables | used in power supplies, connectors and relays |