11/08/26 Tue 8:16am

Electronic Product Finishing

Cleaning Process
- Removes flux residues and contaminants.
- Prepares the board for surface finishing.
Surface Finishing
- Protects copper traces.
- Ensures solderability and performance.
- Common finishes:
  - HASL (Hot Air Solder Leveling)
  - ENIG (Electroless Nickel Immersion Gold)
  - OSP (Organic Solderability Preservative)
  - Immersion Tin/Silver
Silkscreen Printing
- Prints text, labels, component IDs.
- Uses non conductive ink.
Solder Mask application
- Protects copper from oxidation and solder bridging.
- Usually green but other colors are also used
Testing and inspection
- Visual Inspection
- AOI (Automated optical inspection)
- ICT (In-Circuit Testing)
- Flying Probe and Functional Testing

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